TEL U2e-855SS

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Specifications of Equipment

ItemSpecification
Software Version?
Process TypeOxide ETCH
Wafer Size8 Inch (200 mm)
Wafer TypeFlat Zone
Monitor -
Signal Tower3 Lamp, 2side(Front & Back)
Chamber Quantity2 Process Chambers
Chamber TypeUnity SCCM * 2 Chamber
Wafer Handling TypeVacuum Load/Unload Station
Robot Arm TypeAnodized Aluminum
Wafer Clamp TypeESC
ESC TypeCeramic ESC
EPDBoth Chamber
EPD TypeEPD 30X
Automation Online?

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Configuration of Transfer Chamber

DescriptionMakerModelCapacitySerial No.Command
C/C1 Pressure SwitchLeybold PS 113 16014
C/C2 Pressure SwitchLeybold PS 113 16014
T/C ConvactronPhillips275203
T/C CMMKS6220 A01 TDE1 Pa
PCV UnitSTECSV-P1000
DC Power SupplySANKENMLT-DCBOX5+5, ±15, ±24
Transfer RobotYASKAWAVS2C
RC/ELC1YASKAWASRC-Ⅱ015
RPA/ELC2YASKAWASRC-Ⅱ016
Wafer AlignmentYASKAWAVOSJ